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Using Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules overclocked to DDR2-1200

 
 
Phil Weldon
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Posts: n/a
 
      06-18-2007, 09:57 PM
Using Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules overclocked to
DDR2-1200 (FSB 1200 MHz, Memory Clock : CPU Clock ratio = 2:1)
Room Ambient Temperature: 28 C
Memory Heatsink temperature ~ 45 - 50 C
CPU cooling: Stock Intel boxed, retail heatsink/fan

This overclock is stable with Orthos 'Blend - stress CPU and RAM' and with
Othos 'Small FFTs - stress CPU

Motherboard: EVGA 680i
CPU: Intel E4300
Memory: 2 X Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules
Graphics Adapter: EVGA 8800 GTS 320 MB @ 650 MHz GPU / 850 MHz Memory
Operating System: Windows XP SP2 and all security patches
FSB: 1200 MHz
CPU clock multiplier: x9
CPU core voltage: 1.25000 v set, 1.21 v reported

FSB & Memory Config
SLI Memory: [Disable]
FSB - Memory Clock Mode: [Unlinked]

FSB (QDR), MHz: [1200]

MEM (DDR), MHz: [1200]

Memory Timing Setting
Memory Timing Setting: [Expert]
tCL (CAS Latency): [5]
tRCD: [4]
tRP: [4]
tRAS: [9]
Command Per Clock (CMD): [2T]
tRRD: [5]
tRC: [31]
tWR: [6]
tWTR: [6]
tREF: [7.8us]

Voltages
CPU: [1.25000] (1.25000 v set, 1.21 v reported)
CPU FSB: [1.4]
Memory: [2.325]
SPP: [1.45]
MCP: [1.45]
HT SPP <-> MCP: [1.2]

SPD information for Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules

Memory type: DDR2 SDRAM
Error correction: NONE
Voltage interface level: SSTL (1.8V)
Data width: 64 bits
Number of physical banks: 2 (double sided)
Number of logical banks: 4
Number of row addresses: 14 14
Number of col addresses: 10 10
Bank density: 512 MB
Primary RAM Width: 8 8 bits
Error checking RAM Width: 0 0 bits
Module density: 1024 MB
Refresh rate: 7812.500 us
Self-refresh: Yes
Burst lengths supported: 4 8
CAS 3.0:
Cycle time (tCYC) = 5.000 ns fMax = 200.000 MHz
Access time (tAC) = 0.600 ns fMax = 1666.667 MHz

CAS 4.0:
Cycle time (tCYC) = 4.300 ns fMax = 232.558 MHz
Access time (tAC) = 0.500 ns fMax = 2000.000 MHz

CAS 5.0:
Cycle time (tCYC) = 2.500 ns fMax = 400.000 MHz
Access time (tAC) = 0.400 ns fMax = 2500.000 MHz

Minimum delay, Bk/Bk random cols: 0 clocks
Min row precharge time (tRP): 12.500 ns
Min row active delay (tRRD): 7.500 ns
Min RAS to CAS delay (tRCD): 12.500 ns
Min Actv to precharge (tRAS): 39.000 ns
Addr/Cmd setup time: 0.170 ns
Addr/Cmd hold time: 0.250 ns
Data setup time: 0.050 ns
Data hold time: 0.120 ns
Write recovery time (tWR): 15.000 ns
Int Wr to Rd Cmd Dly (tWTR): 7.5 ns
Int Rd to Pchg Cmd Dly (tRPT): 7.500 ns
Min Act/Auto-Rfrsh Time (tRC): 51.500 ns
Min Auto-Rfrsh/Act Cmd (tRFC): 105.000 ns
Max Dev Cycle time (tCK max): 8.000 ns
Max DQS-DQ Skew (tDQSQ max): 2.000 ns
Rd data hold skew Fctr (tQHS): 3.000 ns
PLL relock time: 0.000 ns
Memory analysis probe chars: 00
DIMM type: UDIMM (module width = 133.35mm)
FET switch external enable: No
Analysis probe installed: No
Includes weak dirver: Yes
Manufacturer's JEDC ID code: 0000027f7f7f7f7f
Module manufacturing location: 1 (manufacture dependent)
Module part number: PDC22G8500ELK
Module revision code: 0 (manufacturer dependent)
Module manufacturing date: Not reported
Module serial number: 00000000
SPD revision: 1.1

--NVIDIA Enhanced Performance PRofile SPD information--
SPD version: B1
Profile for Optimal Performance: 01

Profile 0 invalid
Voltage Level: 4.9V
Address Command Rate: 2T
Address Drive Strength: 2.0x
Chip Select Drive Strength: 2.0x
Clock Drive Strength: 1.5x
Data Drive Strength: 1.5x
DQS Drive Strength: 1.5x
Address Fine Delay: 31/64 MEMCLK delay
Address Setup Time: 1 MEMCLK
Chip Select Fine Delay: 31.64 MEMCLK delay
Chip Select Setup Time: 1 MEMCLK delay

Profile 1 valid
Voltage level: 2.3V
Address Command Rate: 2T
Address Drive Stength: 1.0x
Chip Select Drive Strength: 1.0x
Clock Drive Strength: 1.0x
Data Drive Strength: 1.0x
DQS Drive Strength: 1.0x
Address Fine Delay: 1.0
Address Setup Time: 1 MEMCLK
Chip Select Fine Delay: No delay
Chip Select Setup Time: 1 MEMCLK

Each time I look at all this information I discover new concepts, and
realize how wrong some of my older concepts are B^)

I do not intend to try a higher CPU overclock, a different CPU, or a higher
memory overclock until I do something about the heat. Watercooling for the
CPU and better air cooling for the memory. The air is so dry because of the
extreme drought in most of Georgia that 28 C is quite a comfortable indoor
temperature, and an extra $75 US per month to bring it down enough to
improve overclocking is not worth it. I have all the parts for water
cooling, now to find the will.

Phil Weldon


 
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Ed Medlin
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Posts: n/a
 
      06-19-2007, 12:25 PM

"Phil Weldon" <(E-Mail Removed)> wrote in message
news:OcDdi.1825$(E-Mail Removed) ink.net...
> Using Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules overclocked to
> DDR2-1200 (FSB 1200 MHz, Memory Clock : CPU Clock ratio = 2:1)
> Room Ambient Temperature: 28 C
> Memory Heatsink temperature ~ 45 - 50 C
> CPU cooling: Stock Intel boxed, retail heatsink/fan
>
> This overclock is stable with Orthos 'Blend - stress CPU and RAM' and with
> Othos 'Small FFTs - stress CPU
>
> Motherboard: EVGA 680i
> CPU: Intel E4300
> Memory: 2 X Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules
> Graphics Adapter: EVGA 8800 GTS 320 MB @ 650 MHz GPU / 850 MHz Memory
> Operating System: Windows XP SP2 and all security patches
> FSB: 1200 MHz
> CPU clock multiplier: x9
> CPU core voltage: 1.25000 v set, 1.21 v reported
>
> FSB & Memory Config
> SLI Memory: [Disable]
> FSB - Memory Clock Mode: [Unlinked]
>
> FSB (QDR), MHz: [1200]
>
> MEM (DDR), MHz: [1200]
>
> Memory Timing Setting
> Memory Timing Setting: [Expert]
> tCL (CAS Latency): [5]
> tRCD: [4]
> tRP: [4]
> tRAS: [9]
> Command Per Clock (CMD): [2T]
> tRRD: [5]
> tRC: [31]
> tWR: [6]
> tWTR: [6]
> tREF: [7.8us]
>
> Voltages
> CPU: [1.25000] (1.25000 v set, 1.21 v reported)
> CPU FSB: [1.4]
> Memory: [2.325]
> SPP: [1.45]
> MCP: [1.45]
> HT SPP <-> MCP: [1.2]
>
> SPD information for Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules
>
> Memory type: DDR2 SDRAM
> Error correction: NONE
> Voltage interface level: SSTL (1.8V)
> Data width: 64 bits
> Number of physical banks: 2 (double sided)
> Number of logical banks: 4
> Number of row addresses: 14 14
> Number of col addresses: 10 10
> Bank density: 512 MB
> Primary RAM Width: 8 8 bits
> Error checking RAM Width: 0 0 bits
> Module density: 1024 MB
> Refresh rate: 7812.500 us
> Self-refresh: Yes
> Burst lengths supported: 4 8
> CAS 3.0:
> Cycle time (tCYC) = 5.000 ns fMax = 200.000 MHz
> Access time (tAC) = 0.600 ns fMax = 1666.667 MHz
>
> CAS 4.0:
> Cycle time (tCYC) = 4.300 ns fMax = 232.558 MHz
> Access time (tAC) = 0.500 ns fMax = 2000.000 MHz
>
> CAS 5.0:
> Cycle time (tCYC) = 2.500 ns fMax = 400.000 MHz
> Access time (tAC) = 0.400 ns fMax = 2500.000 MHz
>
> Minimum delay, Bk/Bk random cols: 0 clocks
> Min row precharge time (tRP): 12.500 ns
> Min row active delay (tRRD): 7.500 ns
> Min RAS to CAS delay (tRCD): 12.500 ns
> Min Actv to precharge (tRAS): 39.000 ns
> Addr/Cmd setup time: 0.170 ns
> Addr/Cmd hold time: 0.250 ns
> Data setup time: 0.050 ns
> Data hold time: 0.120 ns
> Write recovery time (tWR): 15.000 ns
> Int Wr to Rd Cmd Dly (tWTR): 7.5 ns
> Int Rd to Pchg Cmd Dly (tRPT): 7.500 ns
> Min Act/Auto-Rfrsh Time (tRC): 51.500 ns
> Min Auto-Rfrsh/Act Cmd (tRFC): 105.000 ns
> Max Dev Cycle time (tCK max): 8.000 ns
> Max DQS-DQ Skew (tDQSQ max): 2.000 ns
> Rd data hold skew Fctr (tQHS): 3.000 ns
> PLL relock time: 0.000 ns
> Memory analysis probe chars: 00
> DIMM type: UDIMM (module width = 133.35mm)
> FET switch external enable: No
> Analysis probe installed: No
> Includes weak dirver: Yes
> Manufacturer's JEDC ID code: 0000027f7f7f7f7f
> Module manufacturing location: 1 (manufacture dependent)
> Module part number: PDC22G8500ELK
> Module revision code: 0 (manufacturer dependent)
> Module manufacturing date: Not reported
> Module serial number: 00000000
> SPD revision: 1.1
>
> --NVIDIA Enhanced Performance PRofile SPD information--
> SPD version: B1
> Profile for Optimal Performance: 01
>
> Profile 0 invalid
> Voltage Level: 4.9V
> Address Command Rate: 2T
> Address Drive Strength: 2.0x
> Chip Select Drive Strength: 2.0x
> Clock Drive Strength: 1.5x
> Data Drive Strength: 1.5x
> DQS Drive Strength: 1.5x
> Address Fine Delay: 31/64 MEMCLK delay
> Address Setup Time: 1 MEMCLK
> Chip Select Fine Delay: 31.64 MEMCLK delay
> Chip Select Setup Time: 1 MEMCLK delay
>
> Profile 1 valid
> Voltage level: 2.3V
> Address Command Rate: 2T
> Address Drive Stength: 1.0x
> Chip Select Drive Strength: 1.0x
> Clock Drive Strength: 1.0x
> Data Drive Strength: 1.0x
> DQS Drive Strength: 1.0x
> Address Fine Delay: 1.0
> Address Setup Time: 1 MEMCLK
> Chip Select Fine Delay: No delay
> Chip Select Setup Time: 1 MEMCLK
>
> Each time I look at all this information I discover new concepts, and
> realize how wrong some of my older concepts are B^)
>
> I do not intend to try a higher CPU overclock, a different CPU, or a
> higher
> memory overclock until I do something about the heat. Watercooling for
> the
> CPU and better air cooling for the memory. The air is so dry because of
> the
> extreme drought in most of Georgia that 28 C is quite a comfortable indoor
> temperature, and an extra $75 US per month to bring it down enough to
> improve overclocking is not worth it. I have all the parts for water
> cooling, now to find the will.
>
> Phil Weldon
>
>


Thanks for the update, especially the memory settings. That will help
give me a start since my memory specs are very close to yours and rated for
2.35v. I am pretty much done with the E6600 processor overclock from 2.4ghz
to 3.2ghz. That seems to be about all I can get with liquid cooling. Temps
are not an issue with max load temps in the 50c area. I think that is just
all this particular processor will do. I get the same stability at default
vcore as I do by increasing it. I have had the vcore up to 1.50v with no
increase in stability at any speed. The temps stay fairly constant with only
a small 2-4deg rise but start getting some instability in some programs
although Orthos will run fine up to 3.6ghz. I consider the overclock quite
successful and it is a very noticeable gain in performance from 2.4ghz. I
think that liquid cooling might help you quite a bit and maybe get you up
over 3ghz if you get lucky..

Ed


 
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