"Phil Weldon" <> wrote in message
news:OcDdi.1825$ ink.net...
> Using Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules overclocked to
> DDR2-1200 (FSB 1200 MHz, Memory Clock : CPU Clock ratio = 2:1)
> Room Ambient Temperature: 28 C
> Memory Heatsink temperature ~ 45 - 50 C
> CPU cooling: Stock Intel boxed, retail heatsink/fan
>
> This overclock is stable with Orthos 'Blend - stress CPU and RAM' and with
> Othos 'Small FFTs - stress CPU
>
> Motherboard: EVGA 680i
> CPU: Intel E4300
> Memory: 2 X Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules
> Graphics Adapter: EVGA 8800 GTS 320 MB @ 650 MHz GPU / 850 MHz Memory
> Operating System: Windows XP SP2 and all security patches
> FSB: 1200 MHz
> CPU clock multiplier: x9
> CPU core voltage: 1.25000 v set, 1.21 v reported
>
> FSB & Memory Config
> SLI Memory: [Disable]
> FSB - Memory Clock Mode: [Unlinked]
>
> FSB (QDR), MHz: [1200]
>
> MEM (DDR), MHz: [1200]
>
> Memory Timing Setting
> Memory Timing Setting: [Expert]
> tCL (CAS Latency): [5]
> tRCD: [4]
> tRP: [4]
> tRAS: [9]
> Command Per Clock (CMD): [2T]
> tRRD: [5]
> tRC: [31]
> tWR: [6]
> tWTR: [6]
> tREF: [7.8us]
>
> Voltages
> CPU: [1.25000] (1.25000 v set, 1.21 v reported)
> CPU FSB: [1.4]
> Memory: [2.325]
> SPP: [1.45]
> MCP: [1.45]
> HT SPP <-> MCP: [1.2]
>
> SPD information for Patriot PDC22G8500ELK DDR2-667/PC8500 1 GByte modules
>
> Memory type: DDR2 SDRAM
> Error correction: NONE
> Voltage interface level: SSTL (1.8V)
> Data width: 64 bits
> Number of physical banks: 2 (double sided)
> Number of logical banks: 4
> Number of row addresses: 14 14
> Number of col addresses: 10 10
> Bank density: 512 MB
> Primary RAM Width: 8 8 bits
> Error checking RAM Width: 0 0 bits
> Module density: 1024 MB
> Refresh rate: 7812.500 us
> Self-refresh: Yes
> Burst lengths supported: 4 8
> CAS 3.0:
> Cycle time (tCYC) = 5.000 ns fMax = 200.000 MHz
> Access time (tAC) = 0.600 ns fMax = 1666.667 MHz
>
> CAS 4.0:
> Cycle time (tCYC) = 4.300 ns fMax = 232.558 MHz
> Access time (tAC) = 0.500 ns fMax = 2000.000 MHz
>
> CAS 5.0:
> Cycle time (tCYC) = 2.500 ns fMax = 400.000 MHz
> Access time (tAC) = 0.400 ns fMax = 2500.000 MHz
>
> Minimum delay, Bk/Bk random cols: 0 clocks
> Min row precharge time (tRP): 12.500 ns
> Min row active delay (tRRD): 7.500 ns
> Min RAS to CAS delay (tRCD): 12.500 ns
> Min Actv to precharge (tRAS): 39.000 ns
> Addr/Cmd setup time: 0.170 ns
> Addr/Cmd hold time: 0.250 ns
> Data setup time: 0.050 ns
> Data hold time: 0.120 ns
> Write recovery time (tWR): 15.000 ns
> Int Wr to Rd Cmd Dly (tWTR): 7.5 ns
> Int Rd to Pchg Cmd Dly (tRPT): 7.500 ns
> Min Act/Auto-Rfrsh Time (tRC): 51.500 ns
> Min Auto-Rfrsh/Act Cmd (tRFC): 105.000 ns
> Max Dev Cycle time (tCK max): 8.000 ns
> Max DQS-DQ Skew (tDQSQ max): 2.000 ns
> Rd data hold skew Fctr (tQHS): 3.000 ns
> PLL relock time: 0.000 ns
> Memory analysis probe chars: 00
> DIMM type: UDIMM (module width = 133.35mm)
> FET switch external enable: No
> Analysis probe installed: No
> Includes weak dirver: Yes
> Manufacturer's JEDC ID code: 0000027f7f7f7f7f
> Module manufacturing location: 1 (manufacture dependent)
> Module part number: PDC22G8500ELK
> Module revision code: 0 (manufacturer dependent)
> Module manufacturing date: Not reported
> Module serial number: 00000000
> SPD revision: 1.1
>
> --NVIDIA Enhanced Performance PRofile SPD information--
> SPD version: B1
> Profile for Optimal Performance: 01
>
> Profile 0 invalid
> Voltage Level: 4.9V
> Address Command Rate: 2T
> Address Drive Strength: 2.0x
> Chip Select Drive Strength: 2.0x
> Clock Drive Strength: 1.5x
> Data Drive Strength: 1.5x
> DQS Drive Strength: 1.5x
> Address Fine Delay: 31/64 MEMCLK delay
> Address Setup Time: 1 MEMCLK
> Chip Select Fine Delay: 31.64 MEMCLK delay
> Chip Select Setup Time: 1 MEMCLK delay
>
> Profile 1 valid
> Voltage level: 2.3V
> Address Command Rate: 2T
> Address Drive Stength: 1.0x
> Chip Select Drive Strength: 1.0x
> Clock Drive Strength: 1.0x
> Data Drive Strength: 1.0x
> DQS Drive Strength: 1.0x
> Address Fine Delay: 1.0
> Address Setup Time: 1 MEMCLK
> Chip Select Fine Delay: No delay
> Chip Select Setup Time: 1 MEMCLK
>
> Each time I look at all this information I discover new concepts, and
> realize how wrong some of my older concepts are B^)
>
> I do not intend to try a higher CPU overclock, a different CPU, or a
> higher
> memory overclock until I do something about the heat. Watercooling for
> the
> CPU and better air cooling for the memory. The air is so dry because of
> the
> extreme drought in most of Georgia that 28 C is quite a comfortable indoor
> temperature, and an extra $75 US per month to bring it down enough to
> improve overclocking is not worth it. I have all the parts for water
> cooling, now to find the will.
>
> Phil Weldon
>
>
Thanks for the update, especially the memory settings. That will help
give me a start since my memory specs are very close to yours and rated for
2.35v. I am pretty much done with the E6600 processor overclock from 2.4ghz
to 3.2ghz. That seems to be about all I can get with liquid cooling. Temps
are not an issue with max load temps in the 50c area. I think that is just
all this particular processor will do. I get the same stability at default
vcore as I do by increasing it. I have had the vcore up to 1.50v with no
increase in stability at any speed. The temps stay fairly constant with only
a small 2-4deg rise but start getting some instability in some programs
although Orthos will run fine up to 3.6ghz. I consider the overclock quite
successful and it is a very noticeable gain in performance from 2.4ghz. I
think that liquid cooling might help you quite a bit and maybe get you up
over 3ghz if you get lucky..
Ed
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