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IBM combines SOI & strained silicon

Discussion in 'Intel' started by Yousuf Khan, Sep 9, 2003.

  1. Yousuf Khan

    Yousuf Khan Guest

    IBM Microelectronics has announced that they've found a way to combine
    two different manufacturing techniques, silicon-on-insulator and
    strained silicon, together into a single complementary process called
    SSDOI (strained silicon directly on insulator).

    They also announced a second technique for improving electron
    mobility, which they call HOT (hybrid orientation technique).

    They expect the two manufacturing technologies together to give them a
    65% improvement in performance.


    Yousuf Khan
    Yousuf Khan, Sep 9, 2003
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  2. Yousuf Khan

    ray hartman Guest


    Stretched? Strained? Enough already, YK. We've been there - we've done
    that. S*O*I* in fact! Tech razz ranks right-up-there to flakking
    burgers at Wendys. Surf's up. What gent wouldn't prefer leisurely
    chatting with some smooth_talking brunette hottie behind the bank teller
    window, than pushing a faster ATM button?

    Yawn. Where's my 6502 when I really need it?

    ray hartman
    ray hartman, Sep 22, 2003
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