Thermal Compound
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"TomG" wrote:
ASIII and Shin-Etsu are both about tops, however I don't like Shin-Etsu, it's very awkward to spread in a thin layer. I hear AS ceramique <sp> is also getting some good reports, look for comparisons between those three on the net and make your choice.
regards,
Dion L Heap
www.thetophouse.com
ASIII and Shin-Etsu are both about tops, however I don't like Shin-Etsu, it's very awkward to spread in a thin layer. I hear AS ceramique <sp> is also getting some good reports, look for comparisons between those three on the net and make your choice.
regards,
Dion L Heap
www.thetophouse.com
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On Sat, 05 Jul 2003 13:10:17 -0500, CareBear wrote:
All you need is something to fill the tiny air pockets of the connection between the heatsink base and the cpu. Water will work better than the greases for a short period. None of the thermal comounds have great thermal conductivity but they're many times better than air.
It doesn't matter. You can use axle grease just as well. Toothpaste works too, but I wouldn't use it for long term.
All you need is something to fill the tiny air pockets of the connection between the heatsink base and the cpu. Water will work better than the greases for a short period. None of the thermal comounds have great thermal conductivity but they're many times better than air.Have you ever taken a look at this stuff after say a year of use on a > 1000Mhz CPU? It dries out to a flaky, useless powder. I only discovered this after my CPU began overheating. It's no good for modern CPU's -- at least in the long-term.
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"Dion L Heap" wrote in
What about the Nanotherm PCM+? I thought that was supposed to be the best at the moment?
Cheers,
Vince
What about the Nanotherm PCM+? I thought that was supposed to be the best at the moment?
Cheers,
Vince
"Dion L Heap" wrote:
Don't believe all that "thin layer" nonsense! A good thermal paste (e.g. AS3) has a better thermal conductivity than the base of the heatsink. So it hardly makes any difference whether its a thin or a thick layer. The important thing is that there is enough to fill in all the gaps.
Chip.
Don't believe all that "thin layer" nonsense! A good thermal paste (e.g. AS3) has a better thermal conductivity than the base of the heatsink. So it hardly makes any difference whether its a thin or a thick layer. The important thing is that there is enough to fill in all the gaps.
Chip.
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"Chip" wrote:
So ASIII is more thermally conductive than solid copper? And the manufacturers of ASIII with their directions of how to use their product at :-
http://www.arcticsilver.com/arctic_silver_instructions.htm
Have got it wrong and it's nonsense? That coupled with the physics that says that pure metal to metal or as near as can be obtained contact is also wrong?
Sorry, think I'll stick to what the majority have to say on the subject.
regards,
Dion L Heap
www.thetophouse.com
So ASIII is more thermally conductive than solid copper? And the manufacturers of ASIII with their directions of how to use their product at :-
http://www.arcticsilver.com/arctic_silver_instructions.htm
Have got it wrong and it's nonsense? That coupled with the physics that says that pure metal to metal or as near as can be obtained contact is also wrong?
Sorry, think I'll stick to what the majority have to say on the subject.
regards,
Dion L Heap
www.thetophouse.com
"Dion L Heap" wrote:
(Probably) I stand corrected. The thermal conductivity of Copper is around 394 at room temp, whereas Silver is approx 418. I thought Silver was higher than that. That probably means that AS3 is significantly less than 394.
But that doesn't really detract from my overall point: The thermal conductivity (actually to think of it as thermal resistance is more helpful) will create a temperature gradient through the film of thermal compound. Since the heatsink will squeeze any excess compound out of the way, the difference in actual thickness between a "thick" layer and a "thin" layer ends up being equal to the sqrt(f-all). Given that AS3 (of whatever is actually quite a good conductor of heat (even if its I is perhaps less than 394W/mK) the temperature difference at the point of contact of the compound with the heatsink for a thick layer compared to a thin layer is also sqrt(f-all).
Yes, probably. Smoke and mirrors and general dweeb-ish techie-ness.
Er, what physics? All physics has to say on the matter is thermal conductivity and thickness. It doesn't say anything about pure metal to pure metal.
Fine, you do just that. It won't do any harm either way, so long as you do put enough of the damned stuff on. Put too much on, it perhaps makes 1C of difference (at most). Put not enough on: fried CPU.
Chip.
(e.g.
(Probably) I stand corrected. The thermal conductivity of Copper is around 394 at room temp, whereas Silver is approx 418. I thought Silver was higher than that. That probably means that AS3 is significantly less than 394.
But that doesn't really detract from my overall point: The thermal conductivity (actually to think of it as thermal resistance is more helpful) will create a temperature gradient through the film of thermal compound. Since the heatsink will squeeze any excess compound out of the way, the difference in actual thickness between a "thick" layer and a "thin" layer ends up being equal to the sqrt(f-all). Given that AS3 (of whatever is actually quite a good conductor of heat (even if its I is perhaps less than 394W/mK) the temperature difference at the point of contact of the compound with the heatsink for a thick layer compared to a thin layer is also sqrt(f-all).
at
Yes, probably. Smoke and mirrors and general dweeb-ish techie-ness.
Er, what physics? All physics has to say on the matter is thermal conductivity and thickness. It doesn't say anything about pure metal to pure metal.
Fine, you do just that. It won't do any harm either way, so long as you do put enough of the damned stuff on. Put too much on, it perhaps makes 1C of difference (at most). Put not enough on: fried CPU.
Chip.
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"Chip" wrote:
It certainly will be as you will not technically find any silver in ASIII, I believe it may be silver oxide, then add the holding compound, plus all the other "impurities)
Again no, the idea of the compound is this, consider that air is an insulator, consider the irregularities of both the chip surface and the surface of the HS, the idea is to get as much metal to metal contact as possible, therefore, all you are trying to do is fill ALL voids down to the microscopic level, that is it.
Given that AS3 (of whatever is
If that was what it was, if I was using techieness to sell an expensive consumable, do you think it would be preferable, from a sales point of view, to advise people to use a thick layer, = more sales.
Think you need to study physics a bit more mate ;o)
Start here :-
http://firingsquad.gamers.com/guides/heatsinkphysics/default.asp
http://www.pc-workshop.net/articles/heatsinkphys1.shtml
regards,
Dion L Heap
It certainly will be as you will not technically find any silver in ASIII, I believe it may be silver oxide, then add the holding compound, plus all the other "impurities)
helpful)
Again no, the idea of the compound is this, consider that air is an insulator, consider the irregularities of both the chip surface and the surface of the HS, the idea is to get as much metal to metal contact as possible, therefore, all you are trying to do is fill ALL voids down to the microscopic level, that is it.
Given that AS3 (of whatever is
If that was what it was, if I was using techieness to sell an expensive consumable, do you think it would be preferable, from a sales point of view, to advise people to use a thick layer, = more sales.
Think you need to study physics a bit more mate ;o)
Start here :-
http://firingsquad.gamers.com/guides/heatsinkphysics/default.asp
http://www.pc-workshop.net/articles/heatsinkphys1.shtml
regards,
Dion L Heap
"Dion L Heap" wrote:
OK, I accept this.
Forgive, but I do know this. I haven't just crawled out from under a stone;-) My point is that it makes bugger difference whether you have a "thick" layer or a "thin" layer. Like I said, most of it gets squeezed out anyway - take a look at the bottom of the heatsink when you remove it.
Irrelevant. I am not arguing that a "thin" layer is worse. I accept it might make 1C of difference and these guys are in the business of claiming the lowest possible temps. Furthermore, they could hardly tell you "don't put a thick layer on because AS3 isn't actually a very good conductor of heat", could they? LOL. All I am saying is don't get hung up about it. Thick layer - thin layer - who cares? Just make sure you've got enough on.
Er, nice try, but no I don't think so! Actually my degree is in Physics from Imperial College, London. (And it included a fair bit on Statistical Mechanics and Thermodynamics "stat mech and thermo" <yuk> which covers this in just a *little* bit more depth LOL!)
Cheers,
Chip.
OK, I accept this.
Forgive, but I do know this. I haven't just crawled out from under a stone;-) My point is that it makes bugger difference whether you have a "thick" layer or a "thin" layer. Like I said, most of it gets squeezed out anyway - take a look at the bottom of the heatsink when you remove it.
Irrelevant. I am not arguing that a "thin" layer is worse. I accept it might make 1C of difference and these guys are in the business of claiming the lowest possible temps. Furthermore, they could hardly tell you "don't put a thick layer on because AS3 isn't actually a very good conductor of heat", could they? LOL. All I am saying is don't get hung up about it. Thick layer - thin layer - who cares? Just make sure you've got enough on.
Er, nice try, but no I don't think so! Actually my degree is in Physics from Imperial College, London. (And it included a fair bit on Statistical Mechanics and Thermodynamics "stat mech and thermo" <yuk> which covers this in just a *little* bit more depth LOL!)
Cheers,
Chip.
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On Wed, 09 Jul 2003 07:02:10 +0100, Chip wrote:
Why don't you give it up? You've already embarrassed yourself. Now you're embarrassing your college and the people of London. But don't feel alone. We have our share of educated idiots over here too.
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"Wes Newell" wrote:
ROFLMAO
regards,
Dion L Heap
www.thetophouse.com
ROFLMAO
regards,
Dion L Heap
www.thetophouse.com
"Dion L Heap" wrote:
Hilarious. Oh and BTW, I am not even slightly embarrassed. Why should I be? All I have done is make some simple statements backed up by an element of technical knowledge. I even have the humility to admit when I am wrong (i.e. about the thermal conductivity of AS3).
You on the other hand stoop to cheap comments to the effect that I should read up on Physics. Somewhat ironic given my background in the subject.
Still, its not worth getting worked up about. You just keep on doing whatever makes you happy.
Chip.
alone.
Hilarious. Oh and BTW, I am not even slightly embarrassed. Why should I be? All I have done is make some simple statements backed up by an element of technical knowledge. I even have the humility to admit when I am wrong (i.e. about the thermal conductivity of AS3).
You on the other hand stoop to cheap comments to the effect that I should read up on Physics. Somewhat ironic given my background in the subject.
Still, its not worth getting worked up about. You just keep on doing whatever makes you happy.
Chip.
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On Wed, 09 Jul 2003 10:51:18 +0100, Chip wrote:
That's what my mother said when I was a teenager. I disappointed her too.A
I would have expected better from you.
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